For 5G communication system, heat is a problem that all circuit designers are very concerned about, especially for the large signals. In RF and microwave circuits, large signals are commonly used in power amplifiers and system transmitting components. Whether continuous wave signals or pulse signals, if the generated heat is not effectively transmitted, it will lead to heat accumulation on PCB and in the system. For electronic equipment, heating means shortening the working life.
The 4G antenna is connected to the RRU after the RF beamforming network, that is, it only needs a large power amplifier. The antenna used in the 5G base station is connected to a small power amplifier behind each vibrator, which creates a more serious heat dissipation problem! From 4G to 5G antennas, the area is smaller, and the power amplifier is just sandwiched between the front of the antenna and the PCB, which is more unfavorable to heat dissipation. 5G communication RF amplifier is usually placed in a sealed enclosure, so that its electronic components do not directly contact with air. The common heat dissipation method is to install an aluminum heat radiator on the amplifier shell, and to ensure the high efficiency of the heat dissipation, heat should be transferred through thermal conductive materials. so thermal conductive silica gel can be selected to ensure the normal operation of the RF power amplifier module. We can see that heat sinks and the related thermal conductive materials, they are all much needed.
Therefore, as 5G grows, so do the demands for heat sinks including aluminum heatsink, cooper heatsinks and thermal conductive materials.
We look forward to growing together for custom heatsink with 5G.