With the development of the Internet of Things, Edge computing and 5G applications, data AI has driven the global computing power into a rapid growth period. The design of the next generation of heat spreader would mainly move towards to two directions: one is to upgrade the existing heat dissipation module with 3D soaking plate (3DVC), the other is to import the liquid cooling system include liquid cooling heatsinks and use liquid as the thermal convection medium to improve the heat dissipation efficiency. Therefore, the number of liquid cooling test cases will increase significantly in 2023, but 3DVC is only a transitional scheme after all, so it is estimated that from 2024 to 2025, we will enter the era of parallel gas cooling and liquid cooling. The market demand on different heatsinks would be increased for aluminum profile heatinks, water cooling heatsinks and heatsink plates of pure cooper heatsink or aluminum heatsink, etc.
According to research firm TrendForce, the proportion of AI server shipments equipped with GPGPU (General Purpose GPU) was about 1% in 2022. However, driven by the ChatGPT application in 2023, it is expected that AI server shipments will grow by about 38.4%, and the overall AI server shipments from 2022 to 2026 will have a compound annual growth rate of 29%.
The AI technology would bring great change and new innovations on cooling industry and our products heatsinks especially extruded heat sinks would face challenges on either product design or processing innovations.